Patent Assignment
Reel/Frame 060697/0592
Assignment of Assignor's Interest
Recorded: 2022-08-02
Pages: 3
Assignors
WU, HAW-YUN
Executed: 2022-07-31
WU, CHEN-BAU
Executed: 2022-08-01
YU, JIUN-LEI
Executed: 2022-07-27
TSAI, CHUN-LIN
Executed: 2022-07-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Wafer-on-wafer Cascode HEMT Device