Patent Assignment
Reel/Frame 060702/0400
Assignment of Assignor's Interest
Recorded: 2022-08-02
Pages: 4
Assignors
TSAI, WU-WEI
Executed: 2022-07-20
CHEN, YAN-YI
Executed: 2022-07-24
HSIANG, YU-MING
Executed: 2022-07-20
CHEN, HAI-CHING
Executed: 2022-07-21
LIN, CHUNG-TE
Executed: 2022-07-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure and Manufacturing Method Thereof