Patent Assignment
Reel/Frame 060707/0079
Assignment of Assignor's Interest
Recorded: 2022-08-03
Pages: 3
Assignors
NAKAMURA, TOMONORI
Executed: 2022-06-03
OHTSUKA, KENICHI
Executed: 2022-06-03
ARANO, SATOSHI
Executed: 2022-06-03
TSUCHIYA, KUNIHIKO
Executed: 2022-06-03
Assignee
HAMAMATSU PHOTONICS K.K.
1126-1, ICHINO-CHO, HIGASHI-KU, HAMAMATSU-SHI, SHIZUOKA, 435-8558, JAPAN
Covered Property
(1)
Film Thickness Measuring Device and Film Thickness Measuring Method