IP Library Granted Patent US 12,523,463
Granted Patent B2
US 12,523,463 · App. 17/797,193 · Granted Jan 13, 2026

Film thickness measuring device and film thickness measuring method

Inventors: Tomonori Nakamura (Hamamatsu, JP); Kenichi Ohtsuka (Hamamatsu, JP); Satoshi Arano (Hamamatsu, JP); Kunihiko Tsuchiya (Hamamatsu, JP)
Assignee: HAMAMATSU PHOTONICS K.K.
G01B11/06G01B11/0608G01B11/0633G01B11/0691G01B15/02G01J3/027G01J9/00G02B27/141
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Quick Facts
Patent No.
US 12,523,463
App. No.
17/797,193
Granted
Jan 13, 2026
Kind
B2
Abstract

A film thickness measuring apparatus includes a light irradiation unit configured to irradiate an object with light in a planar shape, an optical element having a transmittance and a reflectance changing according to wavelengths in a predetermined wavelength range, the optical element being configured to separate light from the object by transmitting and reflecting the light, an imaging unit configured to photograph light separated by the optical element, and an analysis unit configured to estimate a film thickness of the object based on a signal from the imaging unit photographing light, in which the light irradiation unit emits light having a wavelength included in the predetermined wavelength range of the optical element.

Claims (18)

1 . A film thickness measuring apparatus comprising:

a light irradiator configured to irradiate an object with light in a planar shape;

an optical filter having a transmittance linearly changing according to wavelengths in a predetermined wavelength range, the optical filter being configured to separate light from the object by transmitting and reflecting the light;

an imager configured to photograph light separated by the optical filter; and

an analyzer configured to estimate a film thickness of the object based on a signal from the imager photographing light,

wherein the light irradiator emits light having a wavelength comprised in the predetermined wavelength range of the optical filter,

wherein the imager includes a first area sensor configured to capture an image of light transmitted through the optical element and to output the transmitted image, and a second area sensor configured to capture an image of light reflected through the optical element and to output the reflected image, and

wherein the analyzer calculates a wavelength center for each pixel based on a value of each pixel corresponding to the transmitted image and the reflected image, and estimates a film thickness corresponding to each pixel.

2 . The film thickness measuring apparatus according to claim 1 , wherein the analyzer estimates a film thickness by further considering an angle of light with which the object is irradiated.

3 . The film thickness measuring apparatus according to claim 1 , wherein the light irradiator irradiates the object with diffused light.

4 . The film thickness measuring apparatus according to claim 3 , wherein the light irradiator has a light guide plate configured to generate the diffused light.

5 . The film thickness measuring apparatus according to claim 1 , further comprising a bandpass filter disposed between the optical filter and the imager.

6 . A film thickness measuring method comprising:

irradiating an object with light in a planar shape;

photographing with an imager light separated by an optical filter, the optical filter having a transmittance linearly changing according to wavelengths in a predetermined wavelength range and being configured to separate light from the object by transmitting and reflecting the light; and

deriving with an analyzer a wavelength based on a photographing result and estimating a film thickness of the object based on the wavelength,

wherein the imager includes a first area sensor configured to capture an image of light transmitted through the optical filter and to output the transmitted image, and a second area sensor configured to capture an image of light reflected through the optical filter and to output the reflected image, and

wherein the analyzer calculates a wavelength center for each pixel based on a value of each pixel corresponding to the transmitted image and the reflected image, and estimates a film thickness corresponding to each pixel.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 3, 2022
From: NAKAMURA, TOMONORI; OHTSUKA, KENICHI; ARANO, SATOSHI; TSUCHIYA, KUNIHIKO
To: HAMAMATSU PHOTONICS K.K.
Reel/Frame 060707/0079 →
Priority Claims (1)
JP 2020-022724 · Feb 13, 2020 · national
Continuity (1)
Related Publication 20230058064A1 · Feb 23, 2023
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