Patent Assignment
Reel/Frame 060707/0740
Assignment of Assignor's Interest
Recorded: 2022-08-03
Pages: 8
Assignors
TANEDA, HIROSHI
Executed: 2022-07-26
SHIMIZU, NORIYOSHI
Executed: 2022-07-27
MIZUTANI, RIE
Executed: 2022-08-01
TAKIZAWA, MASAYA
Executed: 2022-07-27
AKIYAMA, YOSHIKI
Executed: 2022-07-26
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI,, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Wiring Board and Semiconductor Device Each Having Non-Photosensitive Thermosetting Encapsulating Layer Over Photosensitive Resin Layer of Interconnect Structure