Patent Assignment
Reel/Frame 060729/0709
Assignment of Assignor's Interest
Recorded: 2022-08-05
Pages: 5
Assignors
YANG, CHE-CHIA
Executed: 2020-09-04
YEH, SHU-SHEN
Executed: 2020-09-04
LAI, PO-CHEN
Executed: 2020-09-04
YEW, MING-CHIH
Executed: 2020-09-04
LIN, PO-YAO
Executed: 2020-09-04
JENG, SHIN-PUU
Executed: 2020-09-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Package Having Dummy Dies