Patent Assignment
Reel/Frame 060756/0643
Assignment of Assignor's Interest
Recorded: 2022-08-09
Pages: 3
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property
(1)
Methods and Apparatus for Minimizing Voids for Chip on Wafer Components
Application:
17/873,284 →
Publication:
US 2023/0045597
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.