Assignment of Assignor's Interest

Recorded: 2026-02-10 Pages: 4

Assignor

Executed: 2021-10-14

Assignee

APPLIED MATERIALS, INC.

3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054

Covered Property (1)

Methods and Apparatus for Minimizing Voids for Chip on Wafer Components

Application: 17/873,284 →

Publication: US 2023/0045597

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.