IP Library › Assignment 060761/0653
Patent Assignment
Reel/Frame 060761/0653

Assignment of Assignor's Interest

Recorded: 2022-08-09 Pages: 5
Assignors
KARHADE, OMKAR
Executed: 2021-12-30
DESHPANDE, NITIN A.
Executed: 2022-01-05
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Hbi Die Architecture with Fiducial in Street for No Metal Depopulation in Active Die
Application: 17/561,547 →
Publication: US 2023/0207479