HBI die architecture with fiducial in street for no metal depopulation in active die
Embodiments disclosed herein include semiconductor devices. In one embodiment, a die comprises a substrate, where the substrate comprises a semiconductor material. In an embodiment, a backend layer is over the substrate, where the backend layer comprises conductive routing. In an embodiment, the die further comprises a protrusion extending out from an edge of the substrate and the backend layer. In an embodiment, a fiducial is on a surface of the protrusion.
1 . A die, comprising:
a substrate having a first surface opposite a second surface, and a plurality of edges between the first surface and the second surface, wherein the substrate comprises a semiconductor material;
a backend layer over the first surface of the substrate, wherein the backend layer comprises conductive routing;
a protrusion extending laterally out from an edge of the plurality of edges of the substrate and the backend layer; and
a fiducial on a surface of the protrusion.
2 . The die of claim 1 , wherein no metal is provided through a thickness of the protrusion.
3 . The die of claim 1 , wherein the protrusion is at a corner of the substrate.
4 . The die of claim 1 , further comprising:
a second protrusion extending out from a second edge of the substrate and the backend layer.
5 . The die of claim 4 , wherein the second protrusion is at a corner of the substrate opposite from a corner of the substrate where the protrusion is located.
6 . The die of claim 1 , wherein the fiducial is a cross.
7 . The die of claim 1 , wherein the die further comprises a dielectric layer and a plurality of conductive pads through the dielectric layer.
8 . The die of claim 7 , wherein the conductive pads and the dielectric layer are suitable for hybrid bonding or solder bonding.
9 . The die of claim 7 , wherein the conductive pads have a pitch that is approximately 20 μm or less.
10 . The die of claim 1 , further comprising:
transistors on the substrate, wherein no transistors are provided within a footprint of the fiducial.
11 . An electronic package, comprising:
a first die having a first surface opposite a second surface, and a plurality of edges between the first surface and the second surface;
a protrusion extending laterally out from an edge of the plurality of edges of the first die;
a first fiducial on the protrusion;
a second die bonded to the first die; and
a second fiducial on the second die, wherein the first fiducial at least partially overlaps the second fiducial.
12 . The electronic package of claim 11 , wherein the first die is bonded to the second die with a hybrid bonding architecture.
13 . The electronic package of claim 11 , wherein the first die has an active die region, and wherein the fiducial is outside of a footprint of the active die region.
14 . The electronic package of claim 11 , wherein further comprising:
a second protrusion extending out from the first die.
15 . The electronic package of claim 14 , wherein the second protrusion is on a corner of the first die opposite from a corner where the protrusion is located.
16 . The electronic package of claim 11 , wherein the second fiducial is within an active die region of the second die.
17 . The electronic package of claim 11 , wherein the first fiducial and the second fiducial are crosses.
18 . An electronic system, comprising:
a board;
a package substrate coupled to the board;
a first die on the package substrate; and
a second die coupled to the first die, wherein the second die comprises:
a first surface opposite a second surface, and a plurality of edges between the first surface and the second surface;
a protrusion that extends laterally out from an edge of the plurality of edges at a corner of the second die; and
a fiducial on the protrusion, wherein the fiducial is outside of a shadow of an active die region of the second die.
19 . The electronic system of claim 18 , wherein there is no metal over the fiducial in the second die.
20 . The electronic system of claim 18 , wherein the first die is coupled to the second die with a hybrid bonding interconnect architecture.