Three-dimensional integrated circuit structures
Three-dimensional integrated circuit (3DIC) structures are disclosed. A 3DIC structure includes a first die and a second die bonded to the first die. The first die includes a first integrated circuit region and a first seal ring region around the first integrated circuit region, and has a first alignment mark within the first integrated circuit region. The second die includes a second integrated circuit region and a second seal ring region around the second integrated circuit region, and has a second alignment mark within the second seal ring region and corresponding to the first alignment mark.
1. A three-dimensional integrated circuit structure, comprising:
a first die comprising a first integrated circuit region, a first seal ring region surrounding the first integrated circuit region, and a first alignment mark within the first integrated circuit region; and
a second die bonded to the first die, and comprising a second integrated circuit region and a second seal ring region surrounding the second integrated circuit region,
wherein the first alignment mark is around a corner of the second seal ring region from a top view, and
wherein the first alignment mark comprises a first alignment pattern parallel to a first border of the second seal ring region, and a second alignment pattern parallel to a second border of the second seal ring region.
2. The three-dimensional integrated circuit structure of claim 1 , wherein no alignment mark is present within the corner of the second seal ring region.
3. The three-dimensional integrated circuit structure of claim 1 , wherein the first alignment mark of the first die is partially overlapped with seal ring patterns of the second die from a top view.
4. The three-dimensional integrated circuit structure of claim 1 , wherein the first alignment mark of the first die is not overlapped with seal ring patterns of the second die from a top view.
5. The three-dimensional integrated circuit structure of claim 1 , wherein the second die is bonded to the first die through a hybrid bonding comprising a metal-to-metal bonding and a dielectric-to-dielectric bonding.
6. The three-dimensional integrated circuit structure of claim 1 , wherein the first die further comprises a plurality of first seal ring patterns within the first seal ring region and outside of the second seal ring region from a top view.
7. The three-dimensional integrated circuit structure of claim 6 , wherein the first alignment mark and the first seal ring patterns are at substantially the same level.
8. The three-dimensional integrated circuit structure of claim 1 , wherein each of the first alignment mark is square, rectangular, polygonal, strip-shaped, T-shaped, L-shaped, box-shaped or cross-shaped.
9. The three-dimensional integrated circuit structure of claim 1 , wherein the second die further comprises a plurality of second seal ring patterns within the second seal ring region and within the first integrated circuit region from a top view.
10. The three-dimensional integrated circuit structure of claim 1 , further comprising a plurality of through dielectric vias over the first die and surrounding the second die.
11. The three-dimensional integrated circuit structure of claim 10 , further comprising a redistribution layer structure over the second die and electrically connected to the plurality of through dielectric vias.
12. A three-dimensional integrated circuit structure, comprising:
a first die comprising a first integrated circuit region, a first seal ring region surrounding the first integrated circuit region, a first alignment mark within the first integrated circuit region, and a plurality of first seal ring patterns within the first seal ring region; and
a second die bonded to the first die, and comprising a second integrated circuit region and a second seal ring region surrounding the second integrated circuit region, and a plurality of second seal ring patterns within the second seal ring region,
wherein the first alignment mark is around a corner of the second seal ring region from a top view, and part of the first alignment mark is placed between the first seal ring patterns and the second seal ring patterns.
13. The three-dimensional integrated circuit structure of claim 12 , wherein the first alignment mark comprises two strip-shaped alignment patterns perpendicular to each other.
14. The three-dimensional integrated circuit structure of claim 12 , wherein the first alignment mark comprises four strip-shaped alignment patterns designed as a square box.
15. The three-dimensional integrated circuit structure of claim 12 , wherein the first alignment mark surrounds at least some of the first seal ring patterns.
16. The three-dimensional integrated circuit structure of claim 12 , wherein the first alignment mark comprises at least one strip-shaped alignment pattern parallel to a border of the second die.
17. A three-dimensional integrated circuit structure, comprising:
a first die comprising a first integrated circuit region, a first seal ring region surrounding the first integrated circuit region, and a first alignment mark within the first integrated circuit region; and
a second die bonded to the first die, and comprising a second integrated circuit region and a second seal ring region surrounding the second integrated circuit region,
wherein the first alignment mark is around a corner of the second seal ring region from a top view, and comprising two alignment patterns between metal features of a first interconnect structure of the first die.
18. The three-dimensional integrated circuit structure of claim 17 , wherein from the top view, one of the two alignment pattern is within a second integrated circuit region from the top view, and the other of the two alignment patterns is outside of a second seal ring region.
19. The three-dimensional integrated circuit structure of claim 17 , wherein no alignment mark is present within the corner of the second seal ring region.