IP Library Assignment 060762/0205
Patent Assignment
Reel/Frame 060762/0205

Assignment of Assignor's Interest

Recorded: 2022-08-09 Pages: 5
Assignors
KARHADE, OMKAR
Executed: 2021-12-31
DESHPANDE, NITIN A.
Executed: 2022-01-05
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Hbi Die Fiducial Architecture with Cantilever Fiducials for Smaller Die Size and Better Yields
Application: 17/561,553 →
Publication: US 2023/0207480