HBI die fiducial architecture with cantilever fiducials for smaller die size and better yields
Embodiments disclosed herein include semiconductor devices. In an embodiment, a die comprises a substrate, where the substrate comprises a semiconductor material. In an embodiment a fiducial is on the substrate. In an embodiment, the fiducial is a cantilever beam that extends out past an edge of the substrate.
1 . A die, comprising:
a substrate, wherein the substrate comprises a semiconductor material; and
a fiducial on the substrate, wherein the fiducial is a cantilever beam that extends out past an edge of the substrate.
2 . The die of claim 1 , wherein the fiducial comprises a plurality of cantilever beams.
3 . The die of claim 2 , Wherein the plurality of cantilever beams comprises four cantilever beams.
4 . The die of claim 1 , wherein the cantilever beam comprises a metallic material.
5 . The die of claim 4 , wherein the metallic material comprises copper.
6 . The die of claim 1 , wherein the cantilever beam extends approximately 20 μm or more out from the edge of the substrate.
7 . The die of claim 1 , further comprising a plurality of fiducials on the surface of the substrate, wherein each fiducial extends out past an edge of the substrate.
8 . The die of claim 7 , wherein each edge of the substrate comprises a fiducial.
9 . The die of claim 8 , wherein each edge of the substrate comprises a pair of fiducials.
10 . The die of claim 1 , wherein the fiducial is on an outermost surface of the substrate.
11 . An electronic package, comprising:
a first die;
a first fiducial on the first die;
a second die coupled to the first die;
a second fiducial on the second die, wherein the second fiducial is a cantilever beam that extends past an edge of the second die, and wherein the second fiducial at least partially overlaps the first fiducial.
12 . The electronic package of claim 11 , wherein the second fiducial is on an outermost surface of the second die.
13 . The electronic package of claim 11 , wherein the second fiducial is buried within the second die.
14 . The electronic package of claim 11 , wherein the second fiducial comprises four or more cantilever beams.
15 . The electronic package of claim 11 , wherein the first die is bonded to the second die with a hybrid bonding architecture.
16 . The electronic package of claim 11 , wherein the cantilever beam extends approximately 20 μm or more out from the edge of the substrate.
17 . An electronic system, comprising:
a board;
a package substrate coupled to the board;
a first die on the package substrate,
a first fiducial on the first die;
a second die coupled to the first die;
a second fiducial on the second die, wherein the second fiducial is a cantilever beam that extends past an edge of the second die, and wherein the second fiducial at least partially overlaps the first fiducial.
18 . The electronic system of claim 17 , wherein the second fiducial is on an outermost surface of the second die, or wherein the second fiducial is buried within the second die.
19 . The electronic system of claim 17 , wherein the first die is coupled to the second die with a hybrid bonding architecture.