Patent Assignment
Reel/Frame 060763/0042
Assignment of Assignor's Interest
Recorded: 2022-08-09
Pages: 3
Assignors
HAEHN, NICHOLAS S.
Executed: 2017-06-27
CETEGEN, EDVIN
Executed: 2017-07-05
DEVASENATHIPATHY, SHANKAR
Executed: 2017-06-27
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Dual Strip Backside Metallization for Improved Alt-Fli Plating, Koz Minimization, Test Enhancement and Warpage Control