Patent Assignment
Reel/Frame 060771/0801
Assignment of Assignor's Interest
Recorded: 2022-08-10
Pages: 8
Assignors
SCHEPIS, ANTHONY R.
Executed: 2022-07-22
WELOTH, ANDREW
Executed: 2022-08-08
CONKLIN, DAVID C.
Executed: 2022-07-22
DEVILLIERS, ANTON J.
Executed: 2022-08-10
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Hybrid Patterning-Bonding Semiconductor Tool