Assignment of Assignor's Interest

Recorded: 2022-08-11 Pages: 6

Assignors

KIM, JUNHYUNG

Executed: 2022-03-21

LEE, JONG-MIN

Executed: 2022-03-28

CHOI, MINJUNG

Executed: 2022-03-21

CHOI, JIMIN

Executed: 2022-03-30

Assignee

SAMSUNG ELECTRONICS CO., LTD.

129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF

Covered Property (1)

Semiconductor Chip with Stepped Sidewall, Semiconductor Package Including the Same, and Method of Fabricating the Same

Application: 17/882,748 →

Publication: US 2023/0076238