Patent Assignment
Reel/Frame 060789/0410
Assignment of Assignor's Interest
Recorded: 2022-08-11
Pages: 5
Assignors
YOU, JIA-CHUAN
Executed: 2022-08-02
CHANG, CHIA-HAO
Executed: 2022-08-03
CHIANG, KUO-CHENG
Executed: 2022-08-02
WANG, CHIH-HAO
Executed: 2022-08-02
WANG, SHENG-TSUNG
Executed: 2022-08-02
CHEN, CHUN-YUAN
Executed: 2022-08-02
YU, LI-ZHEN
Executed: 2022-08-02
HUANG, LIN-YU
Executed: 2022-08-02
SU, HUAN-CHIEH
Executed: 2022-08-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Device Scaling by Isolation Enhancement
Application:
17/884,394 →
Publication:
US 2023/0335645