Patent Assignment
Reel/Frame 060803/0686
Assignment of Assignor's Interest
Recorded: 2022-08-15
Pages: 5
Assignors
IGA, HAYATO
Executed: 2022-08-08
HIRATA, KAZUYA
Executed: 2022-08-04
HIROSAWA, SHUNICHIRO
Executed: 2022-07-20
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Method of Processing Wafer