Patent Assignment
Reel/Frame 060807/0243
Assignment of Assignor's Interest
Recorded: 2022-08-15
Pages: 3
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Dummy vias in WLP