Patent Assignment
Reel/Frame 060814/0103
Assignment of Assignor's Interest
Recorded: 2022-08-16
Pages: 3
Assignor
LIN, WEI-HUNG
Executed: 2022-08-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Semiconductor Package Including Reinforcement Structure and Methods of Forming the Same