Assignment of Assignor's Interest

Recorded: 2022-08-16 Pages: 6

Assignors

YOUN, DAEHAN

Executed: 2022-03-29

LEE, KYOUNGMIN

Executed: 2022-03-29

HUH, JUNHO

Executed: 2022-03-29

LEE, HEESEOK

Executed: 2022-03-29

Assignee

SAMSUNG ELECTRONICS CO., LTD.

129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF

Covered Property (1)

System on Chip Having Three-Dimensional Chiplet Structure and Electronic Device Including the System on Chip

Application: 17/887,587 →

Publication: US 2023/0107103