Patent Assignment
Reel/Frame 060824/0531
Assignment of Assignor's Interest
Recorded: 2022-08-16
Pages: 3
Assignors
KUO, FU-CHIANG
Executed: 2022-08-08
CHEN, GUAN YU
Executed: 2022-08-08
CHEN, HSIN-LIANG
Executed: 2022-08-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD., 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structure Pattern
Application:
17/819,678 →
Publication:
US 2023/0352404
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.