IP Library › Assignment 076011/0144
Patent Assignment
Reel/Frame 076011/0144

Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 60824 Frame: 531. Assignor(S) Hereby Confirms the Assignment .

Recorded: 2026-07-15 Pages: 6
Assignors
KUO, FU-CHIANG
Executed: 2022-08-08
CHEN, GUAN YU
Executed: 2022-08-08
CHEN, HSIN-LIANG
Executed: 2022-08-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Interconnect Structure Pattern
Application: 17/819,678 →
Publication: US US20230352404A1
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 16, 2022
From: KUO, FU-CHIANG; CHEN, GUAN YU; CHEN, HSIN-LIANG
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 060824/0531 →