Assignment of Assignor's Interest

Recorded: 2022-08-17 Pages: 8

Assignors

SUN, YANGYANG

Executed: 2022-05-22

KULKARNI, SRIKANTH

Executed: 2022-06-23

ZHAO, LILY

Executed: 2022-08-15

SHAH, MILIND

Executed: 2022-07-21

Assignee

QUALCOMM INCORPORATED

5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714

Covered Property (1)

Package Comprising a Substrate and an Interconnection Die Configured for High Density Interconnection

Application: 17/741,986 →

Publication: US 2023/0369234