Patent Assignment
Reel/Frame 060838/0636
Assignment of Assignor's Interest
Recorded: 2022-08-18
Pages: 5
Assignors
FOO, LOKE YIP
Executed: 2022-08-13
YEW, TEONG GUAN
Executed: 2022-08-15
CHEAH, BOK ENG
Executed: 2022-08-12
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Deep Trench Capacitor Bridge for Multi-Chip Package
Application:
17/889,395 →
Publication:
US 2024/0063148
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 9, 2025
From: INTEL CORPORATION
To: ALTERA CORPORATION
Reel/Frame 072704/0307 →
Security Interest
Sep 12, 2025
From: ALTERA CORPORATION
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 073431/0309 →
Assignment of Assignor's Interest
Oct 21, 2025
From: INTEL CORPORATION
To: ALTERA CORPORATION
Reel/Frame 072612/0107 →