Patent Assignment
Reel/Frame 060850/0669
Assignment of Assignor's Interest
Recorded: 2022-08-21
Pages: 4
Assignors
GOH, ENG HUAT
Executed: 2021-12-01
SIR, JIUN HANN
Executed: 2021-12-02
KHOO, POH BOON
Executed: 2021-12-02
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Methods and Apparatus to Reduce Thickness of on-Package Memory Architectures
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.