Patent Assignment
Reel/Frame 060853/0847
Assignment of Assignor's Interest
Recorded: 2022-08-22
Pages: 5
Assignors
CHEN, CHIA-WEI
Executed: 2022-08-04
HSU, WEI CHENG
Executed: 2022-08-03
CHEN, HUI-CHI
Executed: 2022-08-21
CHEN, JIAN-HAO
Executed: 2022-08-03
YU, KUO-FENG
Executed: 2022-08-03
CHIU, SHIH-HANG
Executed: 2022-08-03
WANG, WEI-CHENG
Executed: 2022-08-03
CHEN, YEN-JU
Executed: 2022-08-14
CHENG, CHUN-CHIH
Executed: 2022-08-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Forming Low-Resistance Capping Layer Over Metal Gate Electrode