IP Library › Assignment 060855/0114
Patent Assignment
Reel/Frame 060855/0114

Assignment of Assignor's Interest

Recorded: 2022-08-22 Pages: 3
Assignor
LI, HUI-WEN
Executed: 2022-08-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Properties (2)
Semiconductor Device
Application: 16/803,261 →
Publication: US 2021/0273093
Semiconductor Device
Application: 17/814,683 →
Publication: US 2022/0384644
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 1, 2020
From: LU, ZE-SIAN; CHIANG, TING-WEI; SUE, PIN-DAI; CHEN, JUNG-HSUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 052284/0060 →
Assignment of Assignor's Interest Jul 25, 2022
From: LU, ZE-SIAN; CHIANG, TING-WEI; SUE, PIN-DAI; CHEN, JUNG-HSUAN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 060608/0557 →