Patent Assignment
Reel/Frame 060865/0636
Assignment of Assignor's Interest
Recorded: 2022-08-23
Pages: 5
Assignors
DRAMMEH, AHMED
Executed: 2021-04-02
BEGG, ERIC
Executed: 2021-03-31
TOKARSKI, ZBIGNIEW
Executed: 2021-04-02
JIANG, PEIQI
Executed: 2021-03-31
Assignee
ESSILOR INTERNATIONAL
147 RUE DE PARIS, CHARENTON-LE-PONT, 94220, FRANCE
Covered Property
(1)
Method of Preparing Thick Laminate Wafers for Wafer Thermoforming and Injection Molding