Patent Assignment
Reel/Frame 060883/0705
Assignment of Assignor's Interest
Recorded: 2022-08-24
Pages: 5
Assignors
HWANG, JUNGHA
Executed: 2022-07-09
LIM, DONGCHAN
Executed: 2022-07-07
BAE, SEULGI
Executed: 2022-07-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Conductive Structure and Method for Manufacturing the Same