Patent Assignment
Reel/Frame 060898/0156
Assignment of Assignor's Interest
Recorded: 2022-08-25
Pages: 4
Assignors
HSU, CHIA-KUEI
Executed: 2022-08-25
YEW, MING-CHIH
Executed: 2022-08-22
LIAO, LI-LING
Executed: 2022-08-23
JENG, SHIN-PUU
Executed: 2022-08-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Two-Piece Type Stiffener Structure with Beveled Surface for Delamination Reduction and Methods for Forming the Same