Patent Assignment
Reel/Frame 060898/0520
Assignment of Assignor's Interest
Recorded: 2022-08-25
Pages: 3
Assignors
CHEN, YI-JUNG
Executed: 2022-08-19
TSAI, TSUNG-FU
Executed: 2022-08-20
LU, SZU-WEI
Executed: 2022-08-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Device Bonding Apparatus and Method of Manufacturing a Package Using the Apparatus