Device bonding apparatus and method of manufacturing a package using the apparatus
In an embodiment, a device bonding apparatus is provided. The device bonding apparatus includes a first process station configured to receive a wafer; a first bond head configured to carry a die to the wafer, wherein the first bonding head includes a first rigid body and a vacuum channel in the first rigid body for providing an attaching force for carrying the die to the wafer; and a second bond head configured to press the die against the wafer, the second bond head including a second rigid body and an elastic head disposed over the second rigid body for pressing the die, the elastic head having a center portion and an edge portion surrounding the center portion, the center portion of the elastic head having a first thickness, the edge portion of the elastic head having a second thickness, the second thickness being greater than the second thickness.
1. A device bonding apparatus, comprising:
a first process station configured to receive a wafer;
a first bond head configured to carry a die to the wafer, wherein the first bonding head comprises a first rigid body and a vacuum channel in the first rigid body for providing an attaching force for carrying the die to the wafer; and
a second bond head configured to press the die against the wafer, the second bond head comprising a second rigid body and an elastic head disposed over the second rigid body for pressing the die, the elastic head having a center portion and an edge portion surrounding the center portion, the center portion of the elastic head having a first thickness, the edge portion of the elastic head having a second thickness, the second thickness being greater than the first thickness.
2. The device bonding apparatus of claim 1 , wherein the elastic head comprises rubber or an elastic material.
3. The device bonding apparatus of claim 1 , wherein the edge portion of the elastic head has a ring shape in a plan view.
4. The device bonding apparatus of claim 3 , wherein the edge portion of the elastic head has a width in a range from 200 um to 10000 um.
5. The device bonding apparatus of claim 1 , wherein the center portion of the elastic head has a bowl shape.
6. The device bonding apparatus of claim 1 , wherein the edge portion of the elastic head has a flat surface facing away from the second rigid body.
7. The device bonding apparatus of claim 1 , wherein the center portion of the elastic head has a curved surface facing away from the second rigid body.
8. The device bonding apparatus of claim 1 , wherein the second bond head comprises an optical sensor disposed on a sidewall of the second rigid body, wherein the optical sensor is configured to measure a tilt angle of the wafer with respect to a surface of the second rigid body facing the elastic head.
9. A method for forming a package, the method comprising:
placing a die onto a device wafer by a first bond head;
applying a first force on the die and against the device wafer by the first bond head;
applying a second force on the die and against the device wafer by a second bond head, wherein the second bond head comprises an elastic head, and the elastic head comprises a bottom surface, the bottom surface comprising a center portion and a peripheral portion surrounding the center portion, wherein the center portion of the bottom surface of the second bond head is concave, and wherein the peripheral portion of the bottom surface of the second bond head is flat; and
performing an anneal for bonding the die and the device wafer.
10. The method of claim 9 , wherein the second force is greater than the first force.
11. The method of claim 9 further comprising heating the die with the second bond head.
12. The method of claim 9 , wherein while applying the second force, the peripheral portion of the bottom surface contacts the die, and the center portion of the bottom surface is spaced apart from the die.
13. The method of claim 9 , wherein the second bond head comprises a rigid body and the elastic head disposed over the rigid body, wherein the elastic head comprises rubber or an elastic material.
14. The method of claim 9 , wherein the peripheral portion of the bottom surface of the second bond head has a first ring shape that has a first width in a plan view, and a contact area of the die and the peripheral portion of the second bond head when applying the second force has a second ring shape that has a second width, wherein the second width is ⅓ to ⅔ of the first width.
15. The method of claim 14 , wherein while applying the second force, a distance from an outer edge of the contact area to an outer edge of the first ring shape is in a range from 100 μm to 5000 μm.
16. A method of forming a package, the method comprising:
placing a wafer in a first process station;
placing a semiconductor die onto the wafer;
applying a first force to a center portion of the semiconductor die by a first bond head;
applying a second force to an edge portion of the semiconductor die by a second bond head, wherein the second force is greater than the first force; and
annealing the semiconductor die and the wafer.
17. The method of claim 16 , wherein the edge portion of the semiconductor die has a spacing gap with the wafer after applying the first force and before applying the second force.
18. The method of claim 17 , wherein the spacing gap is reduced by applying the second force.
19. The method of claim 16 , wherein the first force and the second force are both applied in the first process station.
20. The method of claim 16 , wherein the first force is applied in the first process station, and the second force is applied in a second process station different from the first process station.