Patent Assignment
Reel/Frame 060902/0339
Assignment of Assignor's Interest
Recorded: 2022-08-25
Pages: 8
Assignors
CHANG, CHENG-WEI
Executed: 2022-08-16
MORE, SHAHAJI B.
Executed: 2022-08-16
LIANG, SHUEN-SHIN
Executed: 2022-08-14
WANG, SUNG-LI
Executed: 2022-08-14
LIU, YI-YING
Executed: 2022-08-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device and Methods of Fabrication Thereof
Application:
17/886,797 →
Publication:
US 2024/0055485