Patent Assignment
Reel/Frame 060908/0813
Assignment of Assignor's Interest
Recorded: 2022-08-26
Pages: 4
Assignors
YIN, JIN-MU
Executed: 2020-10-06
KAO, HUNG-CHAO
Executed: 2020-10-06
SHEN, HSIANG-KU
Executed: 2020-10-06
CHEN, DIAN-HAU
Executed: 2020-10-06
CHEN, YEN-MING
Executed: 2020-10-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Forming a Stress Reduction Structure for Metal-Insulator-Metal Capacitors