Patent Assignment
Reel/Frame 060911/0719
Assignment of Assignor's Interest
Recorded: 2022-08-26
Pages: 6
Assignors
CHANG, CHENG-WEI
Executed: 2022-07-31
MORE, SHAHAJI B.
Executed: 2022-08-10
LIU, YI-YING
Executed: 2022-08-24
PAI, YUEH-CHING
Executed: 2022-07-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device with Backside Power Rail and Methods of Fabrication Thereof