Patent Assignment
Reel/Frame 060919/0217
Assignment of Assignor's Interest
Recorded: 2022-08-26
Pages: 6
Assignors
USAMI, TATSUYA
Executed: 2022-05-27
MARUYAMA, YOSHIKI
Executed: 2022-03-18
MURAYAMA, YUKI
Executed: 2022-03-25
ISHII, YUJI
Executed: 2022-03-18
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOTO-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Semiconductor Device with Top Wiring Covered by Multiple Passivation Films to Prevent Cracking and Method of Manufacturing the Same