IP Library › Assignment 060927/0740
Patent Assignment
Reel/Frame 060927/0740

Assignment of Assignor's Interest

Recorded: 2022-08-29 Pages: 5
Assignor
AMKOR TECHNOLOGY, INC.
Executed: 2019-11-19
Assignee
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
491B RIVER VALLEY ROAD, VALLEY POINT #12/03, SINGAPORE, 248373, SINGAPORE
Covered Property (1)
Semiconductor Device with a Semiconductor Die Embedded Between an Extended Substrate and a Bottom Substrate
Application: 17/897,556 →
Publication: US 2022/0415769
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 29, 2022
From: KIM, JAE YUN; LIM, GI TAE; JUNG, WOON KAB; YOON, JU HOON
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 061354/0774 →