Patent Assignment
Reel/Frame 061354/0774
Assignment of Assignor's Interest
Recorded: 2022-08-29
Pages: 14
Assignors
KIM, JAE YUN
Executed: 2014-10-09
LIM, GI TAE
Executed: 2014-10-09
JUNG, WOON KAB
Executed: 2014-11-04
YOON, JU HOON
Executed: 2014-11-04
PARK, DONG JOO
Executed: 2014-10-09
CHO, BYONG WOO
Executed: 2014-10-20
HAN, GYU WAN
Executed: 2014-10-13
CHUNG, JI YOUNG
Executed: 2014-10-22
KIM, JIN SEONG
Executed: 2014-10-13
NA, DO HYUN
Executed: 2014-11-04
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Properties
(2)
Semiconductor Device with a Semiconductor Die Embedded Between an Extended Substrate and a Bottom Substrate
Semiconductor Device with a Semiconductor Die Embedded Between an Extended Substrate and a Bottom Substrate
Related Assignments
(2)
Other recorded transfers of the patents in this record — the chain of ownership.