Patent Assignment
Reel/Frame 060939/0968
Assignment of Assignor's Interest
Recorded: 2022-08-30
Pages: 4
Assignors
LIN, YU-SHENG
Executed: 2022-08-24
CHIU, CHEN-NAN
Executed: 2022-08-29
WU, JYUN-LIN
Executed: 2022-08-24
CHUANG, YAO-CHUN
Executed: 2022-08-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package with Ball Grid Array Connection Having Improved Reliability
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.