Patent Assignment
Reel/Frame 060963/0211
Assignment of Assignor's Interest
Recorded: 2022-09-01
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package with Ball Grid Array Connection Having Improved Reliability
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.