Patent Assignment
Reel/Frame 060964/0879
Assignment of Assignor's Interest
Recorded: 2022-09-01
Pages: 5
Assignors
LIN, BO-RONG
Executed: 2022-08-29
CHIANG, KUO-CHENG
Executed: 2022-08-18
JU, SHI-NING
Executed: 2022-08-18
CHEN, GUAN-LIN
Executed: 2022-08-18
WANG, CHIH-HAO
Executed: 2022-08-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Memory Device and Method for Manufacturing the Same
Application:
17/892,364 →
Publication:
US 2024/0064952