Patent Assignment
Reel/Frame 060974/0296
Assignment of Assignor's Interest
Recorded: 2022-09-02
Pages: 3
Assignor
SHIMOMURA, SHINICHIRO
Executed: 2022-09-01
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Processing Apparatus and Substrate Processing Method
Application:
17/929,340 →
Publication:
US 2023/0073624