IP Library › Granted Patent US 12,721,083
Granted Patent B2
US 12,721,083 · App. 17/929,340 · Granted Aug 25, 2026

Substrate processing apparatus and substrate processing method

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Quick Facts
Patent No.
US 12,721,083
App. No.
17/929,340
Filed
Sep 2, 2022
Granted
Aug 25, 2026
Kind
B2
Examiner
WAN, DEMING
Art Unit
3762
USPC
34/357
Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 2, 2022
From: SHIMOMURA, SHINICHIRO
To: TOKYO ELECTRON LIMITED
Reel/Frame 060974/0296 →
Priority Claims (1)
JP 2021-145691 · Sep 7, 2021 · national
Continuity (1)
Related Publication 20230073624A1 · Mar 9, 2023
References Cited (17)
US 6228563B1 · Starov · 2001 [cited by examiner]
US 8845816B2 · Diaz · 2014 [cited by examiner]
US 20120247516A1 · Sato · 2012 [cited by examiner]
US 20190051519A1 · Tsukano · 2019 [cited by examiner]
US 20200168482A1 · Inadomi · 2020 [cited by examiner]
US 20200227253A1 · Park et al. · 2020 [cited by applicant]
JP 2002336675A · 2002 [cited by applicant]
JP 2004510321A · 2004 [cited by applicant]
JP 2011192835A · 2011 [cited by applicant]
JP 2018074103A · 2018 [cited by applicant]
JP 2019067863A · 2019 [cited by applicant]
JP 2020126974A · 2020 [cited by applicant]
KR 1020020093556A · 2002 [cited by applicant]
KR 1020170137245A · 2017 [cited by applicant]
KR 20180055731A · 2018 [cited by examiner]
WO 0187505A1 · 2001 [cited by applicant]
English translation of KR 20180055731 by PE2E. [cited by examiner]