IP Library › Assignment 060993/0039
Patent Assignment
Reel/Frame 060993/0039

Assignment of Assignor's Interest

Recorded: 2022-09-06 Pages: 5
Assignor
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Properties (4)
In-Situ Integrated Wafer Parameter Detection System
Application: 17/751,511 →
Publication: US 2023/0378006
Methods and Apparatus for Processing a Substrate
Application: 17/851,620 →
Publication: US 2023/0416906
In-Situ Low Temperature Measurement of Low Emissivity Substrates
Application: 17/726,808 →
Publication: US 2023/0343615
Methods and Apparatus for Processing a Substrate
Application: 17/875,740 →
Publication: US 2024/0038557
Related Assignments (6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 27, 2022
From: AGARWAL, PRASHANT; KOH, TUCK FOONG; JUPUDI, ANANTHKRISHNA
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 059742/0150 →
Assignment of Assignor's Interest Jun 7, 2022
From: LIM, SOCK HOON
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 060121/0422 →
Assignment of Assignor's Interest Jun 7, 2022
From: SHENG, SHURAN; HOLLAR, ERIC; YANG, YU; ANTONIO, RALPH P.
To: APPLIED MATERIALS, INC.
Reel/Frame 060121/0605 →
Assignment of Assignor's Interest Aug 11, 2022
From: ZHONG, YAOYING; HOI, SIEW KIT
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 060781/0774 →
Assignment of Assignor's Interest Aug 25, 2022
From: KLOCKE, JOHN; HOERNER, BRIDGER EARL
To: APPLIED MATERIALS, INC.
Reel/Frame 060896/0563 →
Assignment of Assignor's Interest Aug 25, 2022
From: ZHONG, YAOYING; HOI, SIEW KIT
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 060896/0790 →