Patent Assignment
Reel/Frame 060993/0580
Assignment of Assignor's Interest
Recorded: 2022-09-06
Pages: 3
Assignors
KRÜGER, PATRICK
Executed: 2022-08-17
VOSS, THOMAS
Executed: 2022-08-17
WIETSTRUCK, MATTHIAS
Executed: 2022-08-17
Assignee
IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS / LEIBNIZ-INSTITUT FÜR INNOVATIVE MIKROELEKTRONIK
IM TECHNOLOGIE PARK 25, FRANKFURT (ODER), 15236, GERMANY
Covered Property
(1)
Method for Annealing Bonding Wafers