Patent Assignment
Reel/Frame 061016/0503
Assignment of Assignor's Interest
Recorded: 2022-09-07
Pages: 8
Assignors
LEE, SEUNGJIN
Executed: 2022-08-25
KIM, JONGHOON
Executed: 2022-08-25
KIM, KYOUNGSUN
Executed: 2022-08-25
PARK, SUNGJOO
Executed: 2022-08-25
YUN, JINSEONG
Executed: 2022-08-25
LEE, YOUNG-HO
Executed: 2022-08-25
CHO, JEONGHYEON
Executed: 2022-08-25
CHO, HEEJIN
Executed: 2022-08-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Having Multilayered Substrate and Manufacturing Method Thereof