Patent Assignment
Reel/Frame 061020/0781
Assignment of Assignor's Interest
Recorded: 2022-09-08
Pages: 7
Assignors
LI, KUN-JU
Executed: 2022-09-06
LIU, HSIN-JUNG
Executed: 2022-09-06
WU, ZONG-SIAN
Executed: 2022-09-06
GAO, WEI-XIN
Executed: 2022-09-06
CHEN, JHIH-YUAN
Executed: 2022-09-06
CHAN, ANG
Executed: 2022-09-06
HOU, CHAU-CHUNG
Executed: 2022-09-06
CHIEN, HSIANG-CHI
Executed: 2022-09-06
LAI, I-MING
Executed: 2022-09-06
Assignee
UNITED MICROELECTRONICS CORP.
NO3, LI-HSIN RD.II, HSINCHU SCIENCE PARK, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Assembly and Method for Manufacturing the Same