Patent Assignment
Reel/Frame 061034/0226
Assignment of Assignor's Interest
Recorded: 2022-08-01
Pages: 3
Assignors
PENG, SHIH-WEI
Executed: 2020-05-18
YUAN, LIPEN
Executed: 2020-05-20
TZENG, JIANN-TYNG
Executed: 2020-05-20
LIN, WEI-CHENG
Executed: 2020-05-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN ROAD, VI, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Mixed Poly Pitch Design Solution for Power Trim