Patent Assignment
Reel/Frame 061076/0570
Assignment of Assignor's Interest
Recorded: 2022-09-13
Pages: 7
Assignors
CHEN, CHAD
Executed: 2022-09-13
LIU, JIAHUI
Executed: 2022-09-13
XIA, WUXING
Executed: 2022-09-13
LIU, JINGYAN
Executed: 2022-09-13
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Leadframe Mounting with Lead Insertion for Lead Wall Bonding
Application:
17/931,651 →
Publication:
US 2024/0090130
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Nov 3, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 061879/0655 →
Release of Security Interest in Patents Recorded at Reel 061879, Frame 0655
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: FAIRCHILD SEMICONDUCTOR CORPORATION; SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064123/0001 →